congatec introduces the conga-IC175, a thin industrial-grade motherboard family featuring the new 7th Gen Intel® Core™ U (Kaby Lake) processors designed for IoT connected devices. The new boards are perfectly suited for space-constrained, high-performance, low-power IoT designs. Besides all the enhancements of the new processor generation, they also offer comprehensive IoT support including a SIM card socket for 3G/4G or Narrow Band connectivity.
This new Thin Mini-ITX industrial motherboard makes it perfectly suited for slim system designs such as industrial GUIs/HMIs, digital signage systems, point-of-sale terminals, and medical tablets. The boards excel through the option of ultra-fast Intel® Optane™ memory via M.2 connector, enabling extremely fast system boots, application starts, video recording and processing, and software updates. The boards further support Hyper-Threading which turns the dual-core design into a 4-in-1 system when utilizing the RTS real time hypervisor.
Exhibitor: congatec Australia Ptv Ltd.